IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
IN_DEVELOPMENT
prSSH EN IEC 61189-3-302:2025
40.20
DIS ballot initiated: 12 weeks
Feb 9, 2026
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