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prSSH EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

40.60     May 11, 2026

60.60   

DPS

DPS/KT 8

European Norm

31.180  

Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.

Life cycle

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prSSH EN IEC 61189-3-302:2025
40.60 Close of voting
May 11, 2026

Related project

Adopted from EN IEC 61189-3-302:2025 IDENTICAL

Adopted from IEC 61189-3-302:2025 ED1 IDENTICAL