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prSSH EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

40.20     Feb 9, 2026

40.60    May 11, 2026

DPS

DPS/KT 8

European Norm

31.180  

Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.

Life cycle

NOW

IN_DEVELOPMENT
prSSH EN IEC 61189-3-302:2025
40.20 DIS ballot initiated: 12 weeks
Feb 9, 2026

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