IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Publication date: 14 qer 2002

General information

Current stage: 99.60 Effective date: 8 qer 2011

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht spanjisht

Buying

Statusi: Revised

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

Language

Language in which you want to receive the document.

Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Life cycle

NOW

WITHDRAWN
IEC 60191-6-12:2002 ED1
99.60 Withdrawal effective
8 qer 2011

REVISED BY

PUBLISHED
IEC 60191-6-12:2011 ED2