IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Publication date: Jun 14, 2002

General information

Current stage: 99.60 Effective date: Jun 8, 2011

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Languages: English Spanish

Buying

Status: Revised

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Life cycle

NOW

WITHDRAWN
IEC 60191-6-12:2002 ED1
99.60 Withdrawal effective
Jun 8, 2011

REVISED BY

PUBLISHED
IEC 60191-6-12:2011 ED2