IEC 62878-2-603:2025 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Publication date: 25 shk 2025

General information

Current stage: 60.60 Effective date: 25 shk 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

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PUBLISHED
IEC 62878-2-603:2025 ED1
60.60 Standard published
25 shk 2025