IEC 62878-2-603:2025 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Publication date: Feb 25, 2025

General information

Current stage: 60.60 Effective date: Feb 25, 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.190

Languages: English French

Buying

Status: Published

PDF - ALL 9,046

Paper - ALL 9,046

CD - ALL 9,046

Language

Language in which you want to receive the document.

Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

Life cycle

NOW

PUBLISHED
IEC 62878-2-603:2025 ED1
60.60 Standard published
Feb 25, 2025