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IEC 62878-2-603 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

General information

50.00     Nov 1, 2024

CFDIS    Jan 24, 2025

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-603 ED1
50.00 Final text received or FDIS registered for formal approval
Nov 1, 2024