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prSSH EN IEC 62878-2-603:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

General information

40.20     Feb 9, 2026

40.60    May 11, 2026

DPS

DPS/KT 8

European Norm

31.180     31.190  

Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

Life cycle

NOW

IN_DEVELOPMENT
prSSH EN IEC 62878-2-603:2025
40.20 DIS ballot initiated: 12 weeks
Feb 9, 2026

Related project

Adopted from EN IEC 62878-2-603:2025 IDENTICAL

Adopted from IEC 62878-2-603:2025 ED1 IDENTICAL

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