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SSH EN IEC 62878-2-603:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Oct 12, 2026

General information

60.60     Oct 12, 2026

95.99   

DPS

DPS/KT 8

European Norm

31.180     31.190  

English  

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Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

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PUBLISHED
SSH EN IEC 62878-2-603:2025
60.60 Standard published
Oct 12, 2026

Related project

Adopted from EN IEC 62878-2-603:2025 IDENTICAL

Adopted from IEC 62878-2-603:2025 ED1 IDENTICAL