Replaced
Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.
WITHDRAWN
IEC PAS 62190:2000 ED1
95.99
Withdrawal of Standard
31 jan 2002
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2