IEC PAS 62190:2000 ED1

Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices

Publication date: Nov 28, 2000

95.99 Withdrawal of Standard Jan 31, 2002

General information

Current stage: 95.99 Effective date: Jan 31, 2002

Originator: IEC

Owner: TC 47

Type: Publicly Available Specification

ICS: 31.080.01

Languages: English

Buying

Status: Replaced

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.

Life cycle

NOW

WITHDRAWN
IEC PAS 62190:2000 ED1
95.99 Withdrawal of Standard
Jan 31, 2002

REVISED BY

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2