IEC PAS 62173:2000 ED1

Solderability test method

Publication date: 22 gush 2000

General information

Current stage: 99.60 Effective date: 15 mar 2004

Originator: IEC

Owner: TC 47

Type: Publicly Available Specification

ICS: 31.080.01

Gjuha: anglisht

Buying

Statusi: Replaced

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

Language

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Scope

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

Life cycle

NOW

WITHDRAWN
IEC PAS 62173:2000 ED1
99.60 Withdrawal effective
15 mar 2004

REVISED BY

WITHDRAWN
IEC 60749-21:2004 ED1