IEC PAS 62173:2000 ED1

Solderability test method

Publication date: Aug 22, 2000

General information

Current stage: 99.60 Effective date: Mar 15, 2004

Originator: IEC

Owner: TC 47

Type: Publicly Available Specification

ICS: 31.080.01

Languages: English

Buying

Status: Replaced

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

Life cycle

NOW

WITHDRAWN
IEC PAS 62173:2000 ED1
99.60 Withdrawal effective
Mar 15, 2004

REVISED BY

WITHDRAWN
IEC 60749-21:2004 ED1