IEC 60749-21:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Publication date: Mar 15, 2004

General information

Current stage: 99.60 Effective date: Apr 7, 2011

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French

Buying

Status: Revised

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Paper - ALL 16,960

CD - ALL 16,960

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Scope

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62173:2000 ED1

NOW

WITHDRAWN
IEC 60749-21:2004 ED1
99.60 Withdrawal effective
Apr 7, 2011

REVISED BY

PUBLISHED
IEC 60749-21:2011 ED2