IEC TR 60286-7:2019 ED1

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Publication date: 14 tet 2019

General information

Current stage: 60.60 Effective date: 14 tet 2019

Originator: IEC

Owner: TC 40

Type: Technical Report

ICS: 31.020 31.240

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Life cycle

NOW

PUBLISHED
IEC TR 60286-7:2019 ED1
60.60 Standard published
14 tet 2019

National adoptions

DS IEC/TR 60286-7:2019

DPS

Paketimi i komponentëve për manovrimin automatik - Pjesa 7: Prezantimi i një pllake termoforme vëllimi për komponentët shumë të vogjël

60.60 Standard published

DPS/KT 7 më tepër