IEC 60191-6-6:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Publication date: 22 mar 2001

General information

Current stage: 60.60 Effective date: 22 mar 2001

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Life cycle

NOW

PUBLISHED
IEC 60191-6-6:2001 ED1
60.60 Standard published
22 mar 2001