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IEC 60191-6-6:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Mar 22, 2001

General information

60.60     Mar 22, 2001

IEC

TC 47/SC 47D

International Standard

31.080.01  

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Scope

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

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PUBLISHED
IEC 60191-6-6:2001 ED1
60.60 Standard published
Mar 22, 2001