SSH EN 60749-19:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 19: Rezistenca ndaj prerjes në stampë

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Publication date: 18 dhj 2006

General information

Current stage: 60.60 Effective date: 1 jan 2006

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Publikuar

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Paper - 1 785 Lekë

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PDF and Paper - 3 570 Lekë

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

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PUBLISHED
SSH EN 60749-19:2003
60.60 Standard published
1 jan 2006

SSH EN 60749-19:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 19: Rezistenca ndaj prerjes në stampë

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

General information

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Scope

Life cycle

NOW

Related project

Adopted from EN 60749-19:2003

Adopted from IEC 60749-19 Ed. 1.0 b