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DS IEC/TS 62610-1:2009

Struktura mekanike për pajisje elektronike - Menaxhimi termal për kabinetet në përputhje me seritë e standardeve IEC 60297 dhe IEC 60917 - Pjesa 1: Udhëzues projektimi: Përmasa e ndërfaqes dhe masat për sistemet ftohëse termoelektrike (efekti Peltier)

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
3 qer 2015

General information

60.60     12 jan 2015

DPS

DPS/KT 7

Technical Specification

31.240  

anglisht  

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Scope

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:<br /> 1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;<br /> 2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;<br /> 3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

Life cycle

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PUBLISHED
DS IEC/TS 62610-1:2009
60.60 Standard published
12 jan 2015

Related project

Adopted from IEC/TS 62610-1 Ed. 1.0 en

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