Qarqet e printuara dhe asemblimet e tyre - Projektimi dhe përdorimi - Pjesa 5-8 Konsiderata të atashuara - Komponentët me sipërfaqe në formë shigjete (BGA, FBGA, CGA, LGA)
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.
Life cycle
NOW
PUBLISHED SSH EN 61188-5-8:2008 60.60
Standard published 1 jan 2008
English