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Specification of a TD measurement method for twin-axial cables
00.00 Proposal for new project received
Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method
00.99 Approval to ballot proposal for new project
Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity
10.60 Close of voting
Semiconductor devices - semiconductor devices for IOT system - part 2: test method of semiconductor photon sources incorporating human factors for wearable equipment
10.60 Close of voting
Integrated Circuits - Standard roadmap for chiplet ICs
00.00 Proposal for new project received
Integrated Circuits - Electronic fuses for low voltage automotive power distribution networks
10.60 Close of voting
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received
Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
10.60 Close of voting
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Semiconductor devices -Part 5-17: Optoelectronic devices - Light emitting diode - Measuring methods of optoelectronic parameters of micro scale light emitting diode array
00.99 Approval to ballot proposal for new project
Semiconductor devices - Part 5-17: Optoelectronic devices - Light emitting diode - Measuring methods of optoelectronic parameters of micro scale light emitting diode array
10.60 Close of voting
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