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Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received
Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
10.60 Close of voting
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Semiconductor devices - Part 14-13: Semiconductor sensors - Performance test methods for spectral sensors
10.60 Close of voting
Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors
10.20 New project ballot initiated
Semiconductor devices - Micro-electromechanical systems - Part 62: Electrical resistance test method for hybrid MEMS materials under combined tensile and torsional deformation
10.20 New project ballot initiated
Micro-electromechanical systems-Part 61: Evaluation methods of localized deformation and stretchability for Hybrid MEMS materials
10.20 New project ballot initiated
CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A
00.99 Approval to ballot proposal for new project
MECHANICAL STRUCTURES FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - LIQUID COOLING<br /> Part 2: Liquid cooling components in electronic enclosures in the IEC60297 series of standards
10.60 Close of voting
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