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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
60.60 Standard published
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
60.60 Standard published
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
60.60 Standard published
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
60.60 Standard published
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
60.60 Standard published
Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
60.60 Standard published
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
60.60 Standard published
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
60.60 Standard published
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
60.60 Standard published
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
60.60 Standard published
Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
60.60 Standard published
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
60.60 Standard published
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
60.60 Standard published
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
60.60 Standard published
English