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Electrolyte and water for vented lead acid accumulators - Part 2: Requirements for water
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
60.60 Standard published
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
60.60 Standard published
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
60.60 Standard published
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
60.60 Standard published
Device embedded substrate - Part 2-1: Guidelines - General description of technology
60.60 Standard published
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
60.60 Standard published
Device embedded substrate - Part 2-3: Guidelines - Design guide
60.60 Standard published
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
60.60 Standard published
Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
60.60 Standard published
Hydraulic machines - Francis turbine pressure fluctuation transposition
60.60 Standard published
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