DPS
Drejtoria e Përgjithshme e Standardizimit
Phone: +355 4 222 62 55
E-mail: info@dps.gov.al
Address: Address: "Reshit Collaku" Str., (nearby ILDKPKI, VI floor), Po.Box 98, Tiranë - Albania
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Projects

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Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements

60.60 Standard published

TC 22/SC 22H more

Transformers, power supplies, reactors and similar products - EMC requirements

60.60 Standard published

TC 96 more

Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification

60.60 Standard published

TC 51 more

Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level

60.60 Standard published

TC 51 more

Corrigendum 1 - Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level

60.60 Standard published

TC 51 more

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

60.60 Standard published

TC 51 more

Multimedia security - Guideline for privacy protection of equipment and systems in and out of use - Part 1: General

60.60 Standard published

TC 100 more

Safety of machinery - Application of protective equipment to detect the presence of persons

60.60 Standard published

TC 44 more

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

60.60 Standard published

TC 47/SC 47F more

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

60.60 Standard published

TC 47/SC 47F more

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

60.60 Standard published

TC 47/SC 47F more