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ISO 9455-5:2020

Soft soldering fluxes — Test methods — Part 5: Copper mirror test
2 tet 2020

General information

90.60     5 mar 2026

ISO

ISO/TC 44/SC 12

International Standard

25.160.50  

anglisht   frëngjisht  

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Scope

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO 9455-5:2014

NOW

PUBLISHED
ISO 9455-5:2020
90.60 Close of review
5 mar 2026