Publikuar
ISO/TS 10303-1741:2018-11 specifies the application module for
Sequential laminate assembly design.
The following are within the scope of
ISO/TS 10303-1741:2018-11:
sequence of application of an embedded component;
sequence of material buildup or lamination;
support for embedded component location;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Revises
ISO/TS 10303-1741:2014
PUBLISHED
ISO/TS 10303-1741:2018
90.93
Standard confirmed
8 gush 2022
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