Publikuar
ISO/TS 10303-1689:2018-11 specifies the application module for
Interconnect physical requirement allocation.
The following are within the scope of
ISO/TS 10303-1689:2018-11:
thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Revises
ISO/TS 10303-1689:2014
PUBLISHED
ISO/TS 10303-1689:2018
90.93
Standard confirmed
4 gush 2022
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