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ISO/TS 10303-1689:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
18 dhj 2018

General information

60.60     18 dhj 2018

ISO

ISO/TC 184/SC 4

Technical Specification

25.040.40  

anglisht  

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Scope

ISO/TS 10303-1689:2018-11 specifies the application module for
Interconnect physical requirement allocation.



The following are within the scope of
ISO/TS 10303-1689:2018-11:



thermal isolation requirement definition;
electrical isolation requirement definition;
thermal isolation template for substrate design;
electrical isolation template for substrate design;
length tolerance on spacing requirement;
allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1689:2014

NOW

PUBLISHED
ISO/TS 10303-1689:2018
60.60 Standard published
18 dhj 2018

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