60.60 18 dhj 2018
ISO/TC 184/SC 4
ISO/TS 10303-1686:2018-11 specifies the application module for
Interconnect module usage view.
The following are within the scope of
the representation of the information needed to describe the interface definition of the interconnect substrate.
This view may be used for the purpose of electrical and mechanical simulation and verification of the
interconnect substrate performance when applied in the next level of assembly.
Complex features including cavities and cutouts are predefined as well as industry standard edge treatments.
The usage view may be treated as a requirement definition by a design organization with links established to
relevant design details in an unpublished model maintained by that design organization.
The usage view is a predefined model of a subset of documentation classified as interface
interconnect substrate features used for next level design;
interconnect substrate cavities;
interconnect substrate cutouts;
interconnect substrate orientation information;
interconnect substrate terminals;
interconnect substrate thickness requirement;
interconnect substrate features that may be accessible from the exterior of the end item;
interconnect substrate terminals that are internally connected;
interconnect substrate terminal identification;
geometric dimensioning and tolerancing.
60.60 Standard published
18 dhj 2018
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