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ISO 9455-14:2017

Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
17 gush 2017

General information

90.93     4 jan 2023

ISO

ISO/TC 44/SC 12

International Standard

25.160.50  

anglisht   frëngjisht  

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Scope

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO 9455-14:1991

NOW

PUBLISHED
ISO 9455-14:2017
90.93 Standard confirmed
4 jan 2023