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ISO/TS 10303-1716:2014

Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template
18 nën 2014
95.99 Withdrawal of Standard   18 dhj 2018

General information

95.99     18 dhj 2018

ISO

ISO/TC 184/SC 4

Technical Specification

25.040.40  

anglisht  

Buying

Shfuqizuar

Language in which you want to receive the document.

Scope


ISO/TS 10303-1716:2014-02 specifies the application module for
Layered interconnect complex template.



The following are within the scope of
ISO/TS 10303-1716:2014-02:



footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO/TS 10303-1716:2010

NOW

WITHDRAWN
ISO/TS 10303-1716:2014
95.99 Withdrawal of Standard
18 dhj 2018

REVISED BY

PUBLISHED
ISO/TS 10303-1716:2018