ISO/TS 10303-1698:2010-07 specifies the application module for
Layered interconnect module design.
The following are within the scope of
ISO/TS 10303-1698:2010-07:
design features;
material stackup;
design patterns;
metalization;
functional and physical network listing;
design layers;
artwork layers;
passages;
items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
items within the scope of application module Component grouping, ISO/TS 10303-1656;
items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
items within the scope of application module Footprint definition, ISO/TS 10303-1646;
items within the scope of application module Land, ISO/TS 10303-1692;
items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.
Revises
ISO/TS 10303-1698:2010
WITHDRAWN
ISO/TS 10303-1698:2010
95.99
Withdrawal of Standard
18 nën 2014
WITHDRAWN
ISO/TS 10303-1698:2014
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