ISO/TS 10303-1741:2010-03 specifies the application module for
Sequential laminate assembly design.
The following are within the scope of
ISO/TS 10303-1741:2010-03:
sequence of application of an embedded component;
sequence of material buildup or lamination;
support for embedded component location;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Revises
ISO/TS 10303-1741:2006
WITHDRAWN
ISO/TS 10303-1741:2010
95.99
Withdrawal of Standard
3 sht 2010
WITHDRAWN
ISO/TS 10303-1741:2010
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.