ISO/TS 10303-1689:2010-03 specifies the application module for
Interconnect physical requirement allocation.
The following are within the scope of
ISO/TS 10303-1689:2010-03:
thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Revises
ISO/TS 10303-1689:2006
WITHDRAWN
ISO/TS 10303-1689:2010
95.99
Withdrawal of Standard
3 sht 2010
WITHDRAWN
ISO/TS 10303-1689:2010
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.