ISO/TS 10303-1688:2010-03 specifies the application module for
Interconnect non planar shape.
The following are within the scope of
three dimensional manifold surface representation of an interconnect substrate;
placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
90.60 Close of review
5 mar 2021
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