ISO/TS 10303-1688:2010

Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape

General information

Current stage: 90.93 Effective date: 25 gush 2022

Originator: ISO

Owner: ISO/TC 184/SC 4

Type: Technical Specification

Scope

ISO/TS 10303-1688:2010-03 specifies the application module for
Interconnect non planar shape.

The following are within the scope of
ISO/TS 10303-1688:2010-03:

three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1688:2006

NOW

PUBLISHED
ISO/TS 10303-1688:2010
90.93 Standard confirmed
25 gush 2022

Preview

Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.