ISO/TS 10303-1650:2006 specifies the application module for
Bare die.
ISO/TS 10303-1650:2006 deals with the
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.
The following is within the scope of
ISO/TS 10303-1650:2006:
definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.
WITHDRAWN
ISO/TS 10303-1650:2006
95.99
Withdrawal of Standard
18 maj 2010
WITHDRAWN
ISO/TS 10303-1650:2010
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