ISO 9453:2006

Soft solder alloys — Chemical compositions and forms

Publication date: 22 sht 2006

95.99 Withdrawal of Standard 18 gush 2014

General information

Current stage: 95.99 Effective date: 18 gush 2014

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Gjuha: anglisht frëngjisht

Buying

Statusi: Shfuqizuar

PDF - 7 576 Lekë

Paper - 7 576 Lekë

CD - 7 576 Lekë

Language

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Scope

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO 9453:1990

NOW

WITHDRAWN
ISO 9453:2006
95.99 Withdrawal of Standard
18 gush 2014

REVISED BY

ABANDON
ISO/NP 9453

WITHDRAWN
ISO 9453:2014