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IEC 60691:2002 ED3

Thermal-links - Requirements and application guide
25 shk 2010

General information

99.60     8 tet 2015

IEC

TC 32/SC 32C

International Standard

29.120.50  

anglisht   frëngjisht  

Buying

Revised

Language in which you want to receive the document.

Scope

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions.
May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60691:1993 ED2

WITHDRAWN
IEC 60691:1993/AMD1:1995 ED2

WITHDRAWN
IEC 60691:1993/AMD2:2000 ED2

NOW

WITHDRAWN
IEC 60691:2002 ED3
99.60 Withdrawal effective
8 tet 2015

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60691:2002/AMD1:2006 ED3

WITHDRAWN
IEC 60691:2002/AMD2:2010 ED3

REVISED BY

WITHDRAWN
IEC 60691:2015 ED4