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IEC 60191-6-1:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
30 tet 2001

General information

60.60     30 tet 2001

IEC

TC 47/SC 47D

International Standard

31.080.01  

anglisht   spanjisht  

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Scope

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Life cycle

NOW

PUBLISHED
IEC 60191-6-1:2001 ED1
60.60 Standard published
30 tet 2001

REVISED BY

ABANDON
IEC 60191-6-1 ED2