IEC 61191-2:1998 ED1

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Publication date: 28 gush 1998

General information

Current stage: 99.60 Effective date: 5 qer 2013

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.240

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 17 526 Lekë

Paper - 17 526 Lekë

CD - 17 526 Lekë

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Scope

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Life cycle

NOW

WITHDRAWN
IEC 61191-2:1998 ED1
99.60 Withdrawal effective
5 qer 2013

REVISED BY

WITHDRAWN
IEC 61191-2:2013 ED2