IEC 61189-1:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Publication date: 22 nën 2001

General information

Current stage: 60.60 Effective date: 27 mar 1997

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Life cycle

NOW

PUBLISHED
IEC 61189-1:1997 ED1
60.60 Standard published
27 mar 1997

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 61189-1:1997/AMD1:2001 ED1