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IEC 61163-2:1998 ED1

Reliability stress screening - Part 2: Electronic components
27 nën 1998

General information

99.60     11 mar 2020

WPUB   

IEC

TC 56

International Standard

03.120.01     31.020  

anglisht   frëngjisht   spanjisht  

Buying

Revised

Language in which you want to receive the document.

Scope

Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60300-3-7:1999 ED1

NOW

WITHDRAWN
IEC 61163-2:1998 ED1
99.60 Withdrawal effective
11 mar 2020

REVISED BY

PUBLISHED
IEC 61163-2:2020 ED2