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IEC 60068-2-58:2015/AMD1:2017 ED4

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
28 korr 2017

General information

60.60     28 korr 2017

IEC

TC 91

International Standard

19.040     31.190  

anglisht   frëngjisht  

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IEC 60068-2-58:2015 ED4

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PUBLISHED
IEC 60068-2-58:2015/AMD1:2017 ED4
60.60 Standard published
28 korr 2017