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IEC 62878-2-5:2019 ED1

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
16 sht 2019

General information

60.60     16 sht 2019

IEC

TC 91

International Standard

31.180     31.190  

anglisht   frëngjisht  

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Scope

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62878-2-5:2015 ED1

NOW

PUBLISHED
IEC 62878-2-5:2019 ED1
60.60 Standard published
16 sht 2019