IEC TS 62647-4:2018 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

Publication date: 10 pri 2018

General information

Current stage: 60.60 Effective date: 16 pri 2018

Originator: IEC

Owner: TC 107

Type: Technical Specification

ICS: 03.100.50 31.020 49.060

Gjuha: anglisht

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Statusi: Publikuar

PDF - 31 660 Lekë

Paper - 31 660 Lekë

CD - 31 660 Lekë

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Scope

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

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PUBLISHED
IEC TS 62647-4:2018 ED1
60.60 Standard published
16 pri 2018