IEC 61189-3-719:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Publication date: 5 jan 2016

General information

Current stage: 60.60 Effective date: 5 jan 2016

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Life cycle

NOW

PUBLISHED
IEC 61189-3-719:2016 ED1
60.60 Standard published
5 jan 2016