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IEC 60749-42:2014 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
12 gush 2014

General information

60.60     12 gush 2014

IEC

TC 47

International Standard

31.080.01  

anglisht   frëngjisht  

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Scope

IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Life cycle

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PUBLISHED
IEC 60749-42:2014 ED1
60.60 Standard published
12 gush 2014