IEC 61189-5-3:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Publication date: 8 jan 2015

General information

Current stage: 60.60 Effective date: 8 jan 2015

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.

Life cycle

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PUBLISHED
IEC 61189-5-3:2015 ED1
60.60 Standard published
8 jan 2015