IEC 60317-2:2012 ED4

Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

Publication date: 12 korr 2012

General information

Current stage: 99.60 Effective date: 8 gush 2019

Next stage: WPUB

Originator: IEC

Owner: TC 55

Type: International Standard

ICS: 29.060.10

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Revised

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Scope

IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition:
- addition of requirements for appearance, new subclause 3.3 and
- addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire

This publication is to be read in conjunction with IEC 60317-0-1:2008.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60317-2:1990 ED3

WITHDRAWN
IEC 60317-2:1990/AMD1:1997 ED3

WITHDRAWN
IEC 60317-2:1990/AMD2:1999 ED3

NOW

WITHDRAWN
IEC 60317-2:2012 ED4
99.60 Withdrawal effective
8 gush 2019

REVISED BY

PUBLISHED
IEC 60317-2:2019 ED5