IEC 60191-6-22:2012 ED1

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Publication date: 11 dhj 2012

General information

Current stage: 60.60 Effective date: 11 dhj 2012

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Life cycle

NOW

PUBLISHED
IEC 60191-6-22:2012 ED1
60.60 Standard published
11 dhj 2012