Replaced
IEC/PAS 62647-3:2011(E) addresses the evaluation of failure mechanisms, thru performance testing, expected in electronic products containing lead-free (Pb-free) solder.
WITHDRAWN
IEC PAS 62647-3:2011 ED1
99.60
Withdrawal effective
25 shk 2014
PUBLISHED
IEC TS 62647-3:2014 ED1