IEC 62047-18:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Publication date: 17 korr 2013

General information

Current stage: 60.60 Effective date: 17 korr 2013

Originator: IEC

Owner: TC 47/SC 47F

Type: International Standard

ICS: 31.080.99

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

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PUBLISHED
IEC 62047-18:2013 ED1
60.60 Standard published
17 korr 2013