IEC 60749-15:2010 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publication date: 28 tet 2010

General information

Current stage: 99.60 Effective date: 14 korr 2020

Next stage: WPUB

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Revised

PDF - 2 261 Lekë

Paper - 2 261 Lekë

CD - 2 261 Lekë

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Scope

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-15:2003 ED1

NOW

WITHDRAWN
IEC 60749-15:2010 ED2
99.60 Withdrawal effective
14 korr 2020

REVISED BY

PUBLISHED
IEC 60749-15:2020 ED3